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So far, I’ve discussed a variety of PCB microelectronics subjects. However, I haven’t covered one of the most crucial areas: PCB fabrication that creates the circuit board undergoing microelectronics assembly. OEMs need to carefully consider fabrication for their products that are assembled via the PCB microelectronics route. The burning question is, “Why is fabrication vitally […]

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“Take an aspirin and call me tomorrow,” is the proverbial, jovial, and often-cited elixir that doctors have prescribed over the years for whatever ails you. Today, medical electronics are adopting the same concept but with new technologies. Now, the phrase, “Take an aspirin,” takes on new meaning, as medical electronics move into new frontiers of […]

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Ideally, OEMs should crave as much functionality as possible out of a chip or die. The chipmaker has done its job to produce ultra-functionality for a given chip generation via its design and manufacturing. But would you believe that there’s still more functionality to glean out of that chip? That’s where multi-tier wire-bonding steps into […]

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In my last column, I talked about protecting both the bare die and associated wire bonding as a major part of today’s PCB microelectronics assembly. I also discussed two die protection methodologies—glob top and lid and cover—as well as a glob top sub-method known as dam and fill. This column will further describe how you […]

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