OEM customers in many cases want to reduce PCB real estate even more than an earlier product generation. The technologies that advanced PCB microelectronics assembly offers these days to do just that provide medical electronics OEMs and other OEMs an array of different options to optimize their product designs, whether they be portable, wearable, insertable […]
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It has been a difficult year for families throughout the world and closer to home, for our friends, families and customers. On the bright side, we’re thankful that promising Covid-19 vaccines are on the horizon. If all goes well in 2021, we’ll be back to normal as much as possible. But in the meantime, despite […]
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Real estate continues to be a precious commodity for substrates, package sizes, dies, and PCBs. One thing stays constant, any way you look at it, and that constant is we continue to shrink the real estate as much as possible. Not long ago, package on package (PoP) was a top technology on the SMT manufacturing […]
Continue Reading...Ideally, OEMs should crave as much functionality as possible out of a chip or die. The chipmaker has done its job to produce ultra-functionality for a given chip generation via its design and manufacturing. But would you believe that there’s still more functionality to glean out of that chip? That’s where multi-tier wire-bonding steps into […]
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As PCB hybrid manufacturing makes greater inroads with microelectronics manufacturing, new inspection tools are coming to the fore. In our industry, microelectronics manufacturing is increasingly becoming the companion of traditional surface-mount technology (SMT) manufacturing due to the growing need for smaller form factors for printed circuit boards (PCBs), chips on board (CoB), flip chips, and […]
Continue Reading...Protecting bare dies on a PCB or substrate is a major process of microelectronics assembly. As we’ve said before, microelectronics assembly and manufacturing work in tandem with traditional SMT manufacturing for complete PCB hybrid manufacturing of today’s smaller form factor products, including IoT, wearables, and portable devices. Wire bonding is an integral part of the […]
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Today, a growing number of OEMs have a sound understanding of how significant PCB hybrid manufacturing is for their new generation of products. That’s because their customers in the medical electronics, mil/aero, commercial, and industrial sectors are demanding greater electronics functionality in smaller, portable devices. This means those devices are based on smaller printed circuit […]
Continue Reading...- 10
- Jun
- 2019
Avoid PCB Wire-bond Loop Failures
Today, hybrid PCB manufacturing is making greater inroads into our industry, which is the marriage of traditional SMT manufacturing together with microelectronics and wire bonding. In many cases, the OEM working with EMS providers doesn’t fully understand the nuances of effective wire bonding and related failures. What has to be considered with new hybrid manufacturing […]
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A number of new terms are entering into today’s PCB discussions. Most of these terms involve those PCBs that continue to shrink, use smaller packaged devices, and have limited real estate. The term, “interposer” is among the newest ones joining such other new terms as PCB hybrid manufacturing, microelectronics, die attach, wire bonding, and others. […]
Continue Reading...- 09
- Apr
- 2019
Die Attach – New Addition to PCB Assembly
Over time, PCB manufacturing has evolved from the traditional through hole, to through hole combined with SMT, and today, a growing number of PCBs are assembled with a combination of SMT and microelectronics or bare die wire bonded onto a substrate or the PCB, itself. Die attach is an integral part of microelectronics. In 2019 […]
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