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As PCB hybrid manufacturing makes greater inroads with microelectronics manufacturing, new inspection tools are coming to the fore. In our industry, microelectronics manufacturing is increasingly becoming the companion of traditional surface-mount technology (SMT) manufacturing due to the growing need for smaller form factors for printed circuit boards (PCBs), chips on board (CoB), flip chips, and […]

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Protecting bare dies on a PCB or substrate is a major process of microelectronics assembly. As we’ve said before, microelectronics assembly and manufacturing work in tandem with traditional SMT manufacturing for complete PCB hybrid manufacturing of today’s smaller form factor products, including IoT, wearables, and portable devices. Wire bonding is an integral part of the […]

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Today, a growing number of OEMs have a sound understanding of how significant PCB hybrid manufacturing is for their new generation of products. That’s because their customers in the medical electronics, mil/aero, commercial, and industrial sectors are demanding greater electronics functionality in smaller, portable devices. This means those devices are based on smaller printed circuit […]

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Today, hybrid PCB manufacturing is making greater inroads into our industry, which is the marriage of traditional SMT manufacturing together with microelectronics and wire bonding. In many cases, the OEM working with EMS providers doesn’t fully understand the nuances of effective wire bonding and related failures. What has to be considered with new hybrid manufacturing […]

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Image source: https://en.wikipedia.org/wiki/Interposer

A number of new terms are entering into today’s PCB discussions. Most of these terms involve those PCBs that continue to shrink, use smaller packaged devices, and have limited real estate. The term, “interposer” is among the newest ones joining such other new terms as PCB hybrid manufacturing, microelectronics, die attach, wire bonding, and others. […]

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Over time, PCB manufacturing has evolved from the traditional through hole, to through hole combined with SMT, and today, a growing number of PCBs are assembled with a combination of SMT and microelectronics or bare die wire bonded onto a substrate or the PCB, itself. Die attach is an integral part of microelectronics. In 2019 […]

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The ISO 13485 Standard is synonymous with quality and reliability for medical electronics products. Wire bonding is the newest technology coming on to the PCB assembly floor, and its basic requirements are for high quality and reliability to further support ISO 13485. This renewed call for quality and reliability in wire bonding is emerging due […]

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For EMS providers and contract manufacturers, the International Standards Organization (ISO) 13485 Standard provides a considerable number of challenges. They all fall under the main category of quality management systems for medical electronics products. But now there is a new wrinkle associated with ISO 13485; this wrinkle isn’t in the books and is rarely spoken […]

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Earlier we talked about wire bond testing for IoT printed circuit boards and the types of wire used to connect a bare chip to a substrate or the PCB surface itself. This discussion deals with wire bond loops pull testing and verification, which is critical for IoT device reliability. Your immediate reaction is probably: What […]

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Wire bonding has traveled far and wide from the early days of semiconductor manufacturing. That’s when wire bonding was used to connect a chip to a package, like the early, early days of dual-in-line (DIP) ceramic and plastic packaging. But today, wire bonding is being performed in microelectronics cleanrooms in PCB assembly and manufacturing areas. […]

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