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Over time, PCB manufacturing has evolved from the traditional through hole, to through hole combined with SMT, and today, a growing number of PCBs are assembled with a combination of SMT and microelectronics or bare die wire bonded onto a substrate or the PCB, itself. Die attach is an integral part of microelectronics. In 2019 […]

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The ISO 13485 Standard is synonymous with quality and reliability for medical electronics products. Wire bonding is the newest technology coming on to the PCB assembly floor, and its basic requirements are for high quality and reliability to further support ISO 13485. This renewed call for quality and reliability in wire bonding is emerging due […]

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For EMS providers and contract manufacturers, the International Standards Organization (ISO) 13485 Standard provides a considerable number of challenges. They all fall under the main category of quality management systems for medical electronics products. But now there is a new wrinkle associated with ISO 13485; this wrinkle isn’t in the books and is rarely spoken […]

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Earlier we talked about wire bond testing for IoT printed circuit boards and the types of wire used to connect a bare chip to a substrate or the PCB surface itself. This discussion deals with wire bond loops pull testing and verification, which is critical for IoT device reliability. Your immediate reaction is probably: What […]

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Wire bonding has traveled far and wide from the early days of semiconductor manufacturing. That’s when wire bonding was used to connect a chip to a package, like the early, early days of dual-in-line (DIP) ceramic and plastic packaging. But today, wire bonding is being performed in microelectronics cleanrooms in PCB assembly and manufacturing areas. […]

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Wire bonding, as shown in Fig. 1, and die shear strength training are inextricably intertwined. Die shear strength is a demanding aspect of wire bonding to assure top quality and reliability to comply with Mil STD 883, Rev. G or Rev. F. In particular, wire bonding and die shear strength testing play prominent roles for […]

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Technical terms are used extensively — and sometimes misused — when it comes to IoT devices and the technologies they are rapidly absorbing. One such term is microelectronics, spoken and written about since the day the transistor was invented. Today, microelectronics takes on another name — namely wire bonding, which again isn’t a new technology […]

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