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If you’ve been reading current medical journals and papers, you know that medical electronics is entering into a new frontier where PCB assembly and manufacturing hasn’t been before. Leading medical electronics OEMs and top healthcare centers are forging ahead with so-called ingestible smart pills and smart cameras that promise to replace large, conventional medical systems. […]

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The industry is increasingly moving toward PCB hybrid assembly involving both traditional SMT and microelectronics assembly and manufacturing. Using the right type of glob top epoxy represents one item that can be easily taken for granted and overlooked during microelectronics manufacturing. Fig. 1 shows an example of a clear epoxy glob top. These are the […]

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Protecting bare dies on a PCB or substrate is a major process of microelectronics assembly. As we’ve said before, microelectronics assembly and manufacturing work in tandem with traditional SMT manufacturing for complete PCB hybrid manufacturing of today’s smaller form factor products, including IoT, wearables, and portable devices. Wire bonding is an integral part of the […]

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Creating a perfect thermal profile for a wearable/IoT PCB undergoing the reflow process is a challenge. That challenge is based on the fact wearable flex PCBs are smaller, and they don’t have sufficient thermal mass compared to conventional rigid PCBs. Also, they have different thicknesses and when it comes to flex, even different thicknesses, where […]

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Fixtures and special tooling are used to further assure surface mount (SM pad) stability and preciseness on a wearable or Internet of Things (IoT) PCB during the pick and place operation. The figure below shows a comparison between fixtures for conventional and flexible PCBs. These assembly steps are especially important since some wearable or IoT […]

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