There is a good chance that all PCB microelectronics assembly and manufacturing processes are not created equal. Currently, that can be a major issue for medical OEMs who are now in the midst of developing or producing their newly advanced miniature medical products. Continue Ready at IConnect007
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Via placement for wearable/IoT flex circuitry is a bit tricky. There are certain rules you must follow. First and foremost, the number of vias has to be limited simply because space is limited. If too many vias are placed, you’re likely blocking critical space for routing traces. Vias go through a lot of fatigue due […]
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- Oct
- 2016
Get a Grip on Wearable/IoT PCB Terminology
Wearable/IoT PCB technology is ushering in new design terminology and steps that need to be factored in. Two particular areas that need to be understood deals with (1) low and high modulus boards and (2) flex circuit bending. Board modulus refers to its structure; low modulus means a softer structure, while high modulus refers to […]
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