Real estate continues to be a precious commodity for substrates, package sizes, dies, and PCBs. One thing stays constant, any way you look at it, and that constant is we continue to shrink the real estate as much as possible. Not long ago, package on package (PoP) was a top technology on the SMT manufacturing […]
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Why is it important to protect bare dies after wire bonding especially when your product is undergoing PCB microelectronics assembly? The answer comes in two parts. One, you need to protect the die for mechanical sturdiness. Two, moisture can at times creep in to create corrosion or oxidation surface finish. Therefore, both the die and […]
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Protecting bare dies on a PCB or substrate is a major process of microelectronics assembly. As we’ve said before, microelectronics assembly and manufacturing work in tandem with traditional SMT manufacturing for complete PCB hybrid manufacturing of today’s smaller form factor products, including IoT, wearables, and portable devices. Wire bonding is an integral part of the […]
Continue Reading...- 10
- Jun
- 2019
Avoid PCB Wire-bond Loop Failures
Today, hybrid PCB manufacturing is making greater inroads into our industry, which is the marriage of traditional SMT manufacturing together with microelectronics and wire bonding. In many cases, the OEM working with EMS providers doesn’t fully understand the nuances of effective wire bonding and related failures. What has to be considered with new hybrid manufacturing […]
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