PCB microelectronics Archives - Nexlogic

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Medical electronics continue to be a game changer, with miniaturization being foremost today in the minds of medical OEMs. In a previous column, I discussed ingestible and implantable medical devices based on remarkably small and unique PCBs, and the technology trends supporting those products continue to dramatically escalate. Today, there is a growing demand for […]

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So far, I’ve discussed a variety of PCB microelectronics subjects. However, I haven’t covered one of the most crucial areas: PCB fabrication that creates the circuit board undergoing microelectronics assembly. OEMs need to carefully consider fabrication for their products that are assembled via the PCB microelectronics route. The burning question is, “Why is fabrication vitally […]

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“Take an aspirin and call me tomorrow,” is the proverbial, jovial, and often-cited elixir that doctors have prescribed over the years for whatever ails you. Today, medical electronics are adopting the same concept but with new technologies. Now, the phrase, “Take an aspirin,” takes on new meaning, as medical electronics move into new frontiers of […]

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Ideally, OEMs should crave as much functionality as possible out of a chip or die. The chipmaker has done its job to produce ultra-functionality for a given chip generation via its design and manufacturing. But would you believe that there’s still more functionality to glean out of that chip? That’s where multi-tier wire-bonding steps into […]

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If you’ve been reading current medical journals and papers, you know that medical electronics is entering into a new frontier where PCB assembly and manufacturing hasn’t been before. Leading medical electronics OEMs and top healthcare centers are forging ahead with so-called ingestible smart pills and smart cameras that promise to replace large, conventional medical systems. […]

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Why is it important to protect bare dies after wire bonding especially when your product is undergoing PCB microelectronics assembly? The answer comes in two parts. One, you need to protect the die for mechanical sturdiness. Two, moisture can at times creep in to create corrosion or oxidation surface finish. Therefore, both the die and […]

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As PCB hybrid manufacturing makes greater inroads with microelectronics manufacturing, new inspection tools are coming to the fore. In our industry, microelectronics manufacturing is increasingly becoming the companion of traditional surface-mount technology (SMT) manufacturing due to the growing need for smaller form factors for printed circuit boards (PCBs), chips on board (CoB), flip chips, and […]

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The world of electronics has reached a new dimension in terms of preciseness. That is now occurring in PCB microelectronics manufacturing with the onset of infinitesimal measurement and calibration of a variety of assembly tasks associated with PCB microelectronics. Recall from our earlier writings that PCB microelectronics manufacturing is a companion to traditional SMT manufacturing, […]

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Wire bonding reliability is certainly critical in PCB microelectronics/wire bonding manufacturing. Wire bond integrity is also related to the reliability of a successful and accurate wire bond. In this particular case, there is actual testing to assure the integrity of wire bonding. It’s called wire bonding pull testing. Pull testing performs several methodologies to test […]

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