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In many instances, OEMs fail to realize that some of their PCB assembly and manufacturing production going offshore can easily be brought back to the United States, saving them time, money, and best of all, keeping their IP intact and protected. Certainly, the lion’s share of PCB SMT production continues to be found at offshore […]

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Medical electronics OEMs may be able to move forward with their prototypes into pilot, medium, and high runs right here on American soil. And it may be sooner than later due in large part to the advances in PCB microelectronics assembly. Advanced medical devices like wearables, portables, insertable, and ingestible products are now either being […]

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OEM customers in many cases want to reduce PCB real estate even more than an earlier product generation. The technologies that advanced PCB microelectronics assembly offers these days to do just that provide medical electronics OEMs and other OEMs an array of different options to optimize their product designs, whether they be portable, wearable, insertable […]

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Real estate continues to be a precious commodity for substrates, package sizes, dies, and PCBs. One thing stays constant, any way you look at it, and that constant is we continue to shrink the real estate as much as possible. Not long ago, package on package (PoP) was a top technology on the SMT manufacturing […]

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Hospitals and other medical centers are scrambling for ventilators in the U. S. and across the globe to help save lives during the Coronavirus pandemic.     EMS providers, contract manufacturers, and PCB fabricators are engaging with medical equipment customers to put into action vast numbers of new PCB orders specifically for the manufacture of thousands […]

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The industry is increasingly moving toward PCB hybrid assembly involving both traditional SMT and microelectronics assembly and manufacturing. Using the right type of glob top epoxy represents one item that can be easily taken for granted and overlooked during microelectronics manufacturing. Fig. 1 shows an example of a clear epoxy glob top. These are the […]

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Protecting bare dies on a PCB or substrate is a major process of microelectronics assembly. As we’ve said before, microelectronics assembly and manufacturing work in tandem with traditional SMT manufacturing for complete PCB hybrid manufacturing of today’s smaller form factor products, including IoT, wearables, and portable devices. Wire bonding is an integral part of the […]

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