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Over time, PCB manufacturing has evolved from the traditional through hole, to through hole combined with SMT, and today, a growing number of PCBs are assembled with a combination of SMT and microelectronics or bare die wire bonded onto a substrate or the PCB, itself. Die attach is an integral part of microelectronics. In 2019 […]

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As shown in Fig. 1, first article inspection or FAI takes a back seat at best in a number of today’s PCB assembly and manufacturing operations. At times, it falls victim to large engineering egos with a strong belief that a particular PCB is “a simple, easy board” that doesn’t require extra time and expense […]

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