pcb manufacturing Archives - Nexlogic

You are here: Tag Archives: pcb manufacturing

Home / Posts tagged "pcb manufacturing"

OEMs and in particular medical equipment OEMs should become familiar with a packaging term now being introduced into PCB microelectronics assembly. This packaging involves a combination of flip-chip and BGA (FCBGA) packaging, Fig. 1. Figure 1: A BGA and a flip-chip interposer. (Source: Thorsten Meyer, Wikipedia, with minor modifications in red) FCBGA is critical due […]

Continue Reading...

A light-sensitive hydrogel for ingestible medical devices has recently been developed by MIT researchers, Fig. 1. Integrated with medical devices, doctors can insert those tiny systems into the human body to treat, diagnose or monitor disorders. Once those devices are no longer needed, they can then be dissolved inside the body by exposing them to […]

Continue Reading...

Over time, PCB manufacturing has evolved from the traditional through hole, to through hole combined with SMT, and today, a growing number of PCBs are assembled with a combination of SMT and microelectronics or bare die wire bonded onto a substrate or the PCB, itself. Die attach is an integral part of microelectronics. In 2019 […]

Continue Reading...

As shown in Fig. 1, first article inspection or FAI takes a back seat at best in a number of today’s PCB assembly and manufacturing operations. At times, it falls victim to large engineering egos with a strong belief that a particular PCB is “a simple, easy board” that doesn’t require extra time and expense […]

Continue Reading...