Today’s PCB microelectronics assembly and manufacturing is still in its early stages and depending on who you talk to, it takes on different methods and procedures at different EMS providers. So, you can safely say that not all microelectronics assembly and manufacturing houses are alike. A good measure to determine if you have the right […]
Continue Reading...- 13
- Oct
- 2020
FCBGA Comes Into PCB Microelectronics Assembly
OEMs and in particular medical equipment OEMs should become familiar with a packaging term now being introduced into PCB microelectronics assembly. This packaging involves a combination of flip-chip and BGA (FCBGA) packaging, Fig. 1. Figure 1: A BGA and a flip-chip interposer. (Source: Thorsten Meyer, Wikipedia, with minor modifications in red) FCBGA is critical due […]
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As I’ve said in earlier columns, the demand for smaller circuitry and packaging, as well as ever-shrinking PCB real estate, have continually pushed PCB assembly and manufacturing protocols. Newer, smaller, portable, and ingestible medical devices are opening new frontiers and are leading OEMs from other industries down that same road. Continue Reading at IConnect007
Continue Reading...- 18
- Aug
- 2020
Are Soft Electronics Coming to Medical Devices?
A light-sensitive hydrogel for ingestible medical devices has recently been developed by MIT researchers, Fig. 1. Integrated with medical devices, doctors can insert those tiny systems into the human body to treat, diagnose or monitor disorders. Once those devices are no longer needed, they can then be dissolved inside the body by exposing them to […]
Continue Reading...As I’ve often said, growing numbers of OEMs are producing small, more portable devices, especially medical electronics OEMs that are pioneering insertable and ingestible medical devices. With these newer, smaller devices coming on the market, EMS providers and contract manufacturers (CMs) must adjust their PCB assembly technologies to comply with these demands. Thermal profiling and […]
Continue Reading...- 09
- Apr
- 2019
Die Attach – New Addition to PCB Assembly
Over time, PCB manufacturing has evolved from the traditional through hole, to through hole combined with SMT, and today, a growing number of PCBs are assembled with a combination of SMT and microelectronics or bare die wire bonded onto a substrate or the PCB, itself. Die attach is an integral part of microelectronics. In 2019 […]
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As shown in Fig. 1, first article inspection or FAI takes a back seat at best in a number of today’s PCB assembly and manufacturing operations. At times, it falls victim to large engineering egos with a strong belief that a particular PCB is “a simple, easy board” that doesn’t require extra time and expense […]
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