A new player is coming in to help make PCB real estate more available on small flex and flex-rigid circuits undergoing microelectronics assembly. It’s called an interposer, and it’s a type of connection that takes connections from one side of the substrate or board or material towards the other side. Further, it is an electrical […]
Continue Reading...
Today’s PCB microelectronics assembly and manufacturing is still in its early stages and depending on who you talk to, it takes on different methods and procedures at different EMS providers. So, you can safely say that not all microelectronics assembly and manufacturing houses are alike. A good measure to determine if you have the right […]
Continue Reading...- 26
- Mar
- 2021
Onshoring for PCB Microelectronics Production?
In many instances, OEMs fail to realize that some of their PCB assembly and manufacturing production going offshore can easily be brought back to the United States, saving them time, money, and best of all, keeping their IP intact and protected. Certainly, the lion’s share of PCB SMT production continues to be found at offshore […]
Continue Reading...- 17
- Nov
- 2020
C4 or C2 Bumps in PCB Microelectronics?
C4 and C2 bumps for flipchip assemblies are among the top techniques that require close attention during PCB microelectronics assembly. Those two are flipchip (FC) bump connection techniques and are crucial for efficient and cost-effective microelectronics assembly. In short, C4 and C2 are interposers that connect a small die in a FCBGA, using flipchip on […]
Continue Reading...- 13
- Oct
- 2020
FCBGA Comes Into PCB Microelectronics Assembly
OEMs and in particular medical equipment OEMs should become familiar with a packaging term now being introduced into PCB microelectronics assembly. This packaging involves a combination of flip-chip and BGA (FCBGA) packaging, Fig. 1. Figure 1: A BGA and a flip-chip interposer. (Source: Thorsten Meyer, Wikipedia, with minor modifications in red) FCBGA is critical due […]
Continue Reading...- 15
- Sep
- 2020
DOEs Ready for New, Smaller Medical Devices
The technology trends in the medical OEM field are moving toward smaller and advanced technologies, as shown in Fig. 1. Some of those advanced technologies are revolutionary new. For example, bio sensors for human and machine interface or HMI and new, flexible electrodes are leading the way. They are among the most recent developments and […]
Continue Reading...As I’ve said in earlier columns, the demand for smaller circuitry and packaging, as well as ever-shrinking PCB real estate, have continually pushed PCB assembly and manufacturing protocols. Newer, smaller, portable, and ingestible medical devices are opening new frontiers and are leading OEMs from other industries down that same road. Continue Reading at IConnect007
Continue Reading...- 18
- Aug
- 2020
Are Soft Electronics Coming to Medical Devices?
A light-sensitive hydrogel for ingestible medical devices has recently been developed by MIT researchers, Fig. 1. Integrated with medical devices, doctors can insert those tiny systems into the human body to treat, diagnose or monitor disorders. Once those devices are no longer needed, they can then be dissolved inside the body by exposing them to […]
Continue Reading...- 12
- Aug
- 2020
DOEs on Call for New Wearable Medical Devices
Medical electronics continue to make even greater technological advances with recent R&D developments and promise to take on new forms. Biosensors for human-machine interfaces (HMIs) and new, flexible electrodes are leading the way. They are among the most recent developments and promise more sophisticated medical wearable devices for health monitoring. Continue Reading at IConnect007
Continue Reading...As I’ve often said, growing numbers of OEMs are producing small, more portable devices, especially medical electronics OEMs that are pioneering insertable and ingestible medical devices. With these newer, smaller devices coming on the market, EMS providers and contract manufacturers (CMs) must adjust their PCB assembly technologies to comply with these demands. Thermal profiling and […]
Continue Reading...