Check Out 5 OEM Benefits for Onshoring PCB Microelectronics Assembly There are five key benefits to U. S. OEMs for onshoring PCB microelectronics assembly and manufacturing. Today’s technology trends are toward PCB microelectronics assembly. However, that doesn’t mean traditional SMT assembly and manufacturing is going away overnight. It will continue to exist to support OEMs […]
Continue Reading...- 26
- Mar
- 2021
Onshoring for PCB Microelectronics Production?
In many instances, OEMs fail to realize that some of their PCB assembly and manufacturing production going offshore can easily be brought back to the United States, saving them time, money, and best of all, keeping their IP intact and protected. Certainly, the lion’s share of PCB SMT production continues to be found at offshore […]
Continue Reading...The outlook appears promising in 2021 for electronics OEMs to bring some or most of their manufacturing back to the U.S. In particular, medical electronics OEMs may be able to move forward with their prototypes into pilot, medium, and high runs right here on American soil. And it may be sooner than later due in […]
Continue Reading...- 27
- Apr
- 2020
PCBs on the Medical Ventilator Frontlines
The unprecedented demand for thousands upon thousands of life-saving ventilators appears to be among the biggest challenges facing medical electronics OEMs today due to the coronavirus pandemic. News reports say that America’s biggest manufacturers are working with medical systems companies to produce the volumes of ventilators needed across the country. But there is also a […]
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The electronics industry is fertile ground for innovation these days, powering the creation of intriguing new products across sectors like the internet of things (IoT), autonomous vehicles, wearable devices, and microelectronics for implantable medical devices. In one instance, research engineers at Purdue have reportedly come up with a powerful transistor that can perform double duty: […]
Continue Reading...- 30
- Dec
- 2019
Understand the basics of multi-tier wire bonding
Electronic systems and equipment OEMs have historically pushed for greater functional integration. This means putting more electronic power on increasingly smaller chips, as well as making sub-assemblies even smaller. All this goes under the banner of increasing performance and decreasing cost. This is truer today for IoT devices than ever before. Continue Reading at IoT […]
Continue Reading...Ideally, OEMs should crave as much functionality as possible out of a chip or die. The chipmaker has done its job to produce ultra-functionality for a given chip generation via its design and manufacturing. But would you believe that there’s still more functionality to glean out of that chip? That’s where multi-tier wire-bonding steps into […]
Continue Reading...Tech companies are talking about designing IoT devices with AI and machine learning. Before getting there, IoT device OEMs must take a couple of steps back and assure themselves of effective printed circuit board microelectronics assembly and manufacturing as an initial step to assure product integrity and reliability. An item such as using the right […]
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The industry is increasingly moving toward PCB hybrid assembly involving both traditional SMT and microelectronics assembly and manufacturing. Using the right type of glob top epoxy represents one item that can be easily taken for granted and overlooked during microelectronics manufacturing. Fig. 1 shows an example of a clear epoxy glob top. These are the […]
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