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The electronics industry is fertile ground for innovation these days, powering the creation of intriguing new products across sectors like the internet of things (IoT), autonomous vehicles, wearable devices, and microelectronics for implantable medical devices. In one instance, research engineers at Purdue have reportedly come up with a powerful transistor that can perform double duty: […]

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OEMs are continually moving toward PCB hybrid assembly, meaning the combination of conventional SMT assembly and microelectronics assembly.  It’s important to know that there are seven major steps that need to be taken to achieve successful PCB hybrid assembly, Fig. 1.  These seven steps are especially important for newly emerging implantable and ingestible medical devices. […]

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Seven major steps need to be taken to achieve successful SMT and microelectronics assembly for medical electronic devices. These key steps take on special significance for newly emerging implantable and ingestible medical devices and result in medical devices that are robust, smaller, highly reliable, more powerful, and lighter. Deploy the right ancillary devices, such as […]

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We can all agree that 2019 brought us many blessings, and we’re all thankful. As we gather this Holiday season with friends and family, we’re looking at 2020 as yet another year with great hope and opportunities. From NexLogic, we wish you, your employees, friends, colleagues, and families a happy holiday season, good health, and […]

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If you’ve been reading current medical journals and papers, you know that medical electronics is entering into a new frontier where PCB assembly and manufacturing hasn’t been before. Leading medical electronics OEMs and top healthcare centers are forging ahead with so-called ingestible smart pills and smart cameras that promise to replace large, conventional medical systems. […]

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The world of electronics has reached a new dimension in terms of preciseness. That is now occurring in PCB microelectronics manufacturing with the onset of infinitesimal measurement and calibration of a variety of assembly tasks associated with PCB microelectronics. Recall from our earlier writings that PCB microelectronics manufacturing is a companion to traditional SMT manufacturing, […]

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Electronics manufacturing services providers who use conventional printed circuit board assembly and manufacturing models are scrambling to augment their production facilities to handle increasingly smaller boards like those used for IoT devices. At today’s advanced printed circuit board (PCB) houses, savvy leaders are homing in on newer technologies and merging conventional surface-mount technology manufacturing with […]

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Wire bonding as a central focus for PCB microelectronics manufacturing demands considerable attention as part of the overall PCB hybrid manufacturing. In particular, wire bond loops and their pull strength for reliability and integrity are critically important. Those wire bond loops must be accurately and correctly calculated, formed and executed on the microelectronics manufacturing floor […]

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Today, hybrid PCB manufacturing is making greater inroads into our industry, which is the marriage of traditional SMT manufacturing together with microelectronics and wire bonding. In many cases, the OEM working with EMS providers doesn’t fully understand the nuances of effective wire bonding and related failures. What has to be considered with new hybrid manufacturing […]

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Image source: https://en.wikipedia.org/wiki/Interposer

A number of new terms are entering into today’s PCB discussions. Most of these terms involve those PCBs that continue to shrink, use smaller packaged devices, and have limited real estate. The term, “interposer” is among the newest ones joining such other new terms as PCB hybrid manufacturing, microelectronics, die attach, wire bonding, and others. […]

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