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In an earlier column, I discussed the prospect of onshoring PCB microelectronics assembly, rather than offshoring, especially for today’s and tomorrow’s advanced miniaturized medical devices. In that discussion, I detailed a comparison between traditional SMT and microelectronics manufacturing and assembly, and pointed out how much easier it is to bring miniaturized OEM devices, especially medical […]

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Today, advanced electronics products are shrinking PCB, component, and packaging sizes and in some instances as small as a postage stamp or even smaller. Therefore, caution has to be taken when products like these are subjected to high temperature reflow cycles. It’s important to consider low-temperature profiling. It is more effective if you can reflow […]

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An urgent call is out to medical equipment makers that thousands—even millions—of ventilators are in the greatest demand in our history due to the worldwide COVID-19 outbreak. Some traditional medical equipment makers haven’t pursued the ventilator business nor have a lot of top manufacturing companies like Tesla, GM, and others that are poised to produce […]

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A unique thermal profile is designed for each PCB job undergoing conventional SMT assembly, as virtually every PCB assembly professional knows. But what about a PCB assembly project involving both conventional rigid board and an extraordinarily small rigid or rigid-flex circuit undergoing microelectronics assembly? In short, that’s called PCB hybrid assembly, which requires two separate, […]

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IoT devices are entering a distinctly new realm when it comes to printed circuit board (PCB) assembly. The reason for that is IoT devices require both traditional surface mount technology (SMT) assembly, as well as microelectronics assembly. The latter involves chip on board, wire bonding, die attach, flip chip and other associated technologies. Continue Reading […]

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PCB microelectronics is increasingly in demand for highly advanced and sophisticated small form factor products like IoT devices, wearables, and similar portable devices. In this regard, PCB fabrication is also advancing — technology speaking — simply due to the fact microelectronics assembly demands precisely fabricated circuit boards. Keep in mind that PCBs going through microelectronics […]

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So far, I’ve discussed a variety of PCB microelectronics subjects. However, I haven’t covered one of the most crucial areas: PCB fabrication that creates the circuit board undergoing microelectronics assembly. OEMs need to carefully consider fabrication for their products that are assembled via the PCB microelectronics route. The burning question is, “Why is fabrication vitally […]

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Why is it important to protect bare dies after wire bonding especially when your product is undergoing PCB microelectronics assembly? The answer comes in two parts. One, you need to protect the die for mechanical sturdiness. Two, moisture can at times creep in to create corrosion or oxidation surface finish. Therefore, both the die and […]

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Protecting bare dies on a PCB or substrate is a major process of microelectronics assembly. As we’ve said before, microelectronics assembly and manufacturing work in tandem with traditional SMT manufacturing for complete PCB hybrid manufacturing of today’s smaller form factor products, including IoT, wearables, and portable devices. Wire bonding is an integral part of the […]

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The world of electronics has reached a new dimension in terms of preciseness. That is now occurring in PCB microelectronics manufacturing with the onset of infinitesimal measurement and calibration of a variety of assembly tasks associated with PCB microelectronics. Recall from our earlier writings that PCB microelectronics manufacturing is a companion to traditional SMT manufacturing, […]

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