- Posted bynexlogic
- inResource Center

Growing numbers of OEM products are becoming smaller to the point of micro miniaturization. Those include medical and commercial products. This emerging breed of OEM product demands PCB microelectronics assembly and especially sub-micron device placement. The current industry standard for accuracy for placement of MEMS devices, sensors, bio sensors or other kinds of pressure sensors […]
Continue Reading...- Posted bynexlogic
- inTechnical Publications

OEMs launching micro-miniature products and relying on PCB microelectronics assembly and manufacturing to help produce those products may find themselves in a quandary. Let’s think about this. The industry standard for accuracy right now for placement of MEMS devices, sensors, biosensors, or other kinds of pressure sensors is five-micron placement accuracy on a very small […]
Continue Reading...- Posted bynexlogic
- inResource Center


Today’s PCB microelectronics assembly and manufacturing is still in its early stages and depending on who you talk to, it takes on different methods and procedures at different EMS providers. So, you can safely say that not all microelectronics assembly and manufacturing houses are alike. A good measure to determine if you have the right […]
Continue Reading...- Posted bynexlogic
- inTechnical Publications



There is a good chance that all PCB microelectronics assembly and manufacturing processes are not created equal. Currently, that can be a major issue for medical OEMs who are now in the midst of developing or producing their newly advanced miniature medical products. Continue Ready at IConnect007
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