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OEMs and in particular medical equipment OEMs should become familiar with a packaging term now being introduced into PCB microelectronics assembly. This packaging involves a combination of flip-chip and BGA (FCBGA) packaging, Fig. 1. Figure 1: A BGA and a flip-chip interposer. (Source: Thorsten Meyer, Wikipedia, with minor modifications in red) FCBGA is critical due […]

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Medical miniaturization is rapidly evolving for a number of reasons. Among them are the fact that doctors, hospitals, and other medical care facilities are requiring more functionality, increased portability, and more robustness to upgrade surgical procedures and mobile monitoring equipment. Also, highly complex devices successfully interacting with the human body are driving the need for […]

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