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Protecting bare dies on a PCB or substrate is a major process of microelectronics assembly. As we’ve said before, microelectronics assembly and manufacturing work in tandem with traditional SMT manufacturing for complete PCB hybrid manufacturing of today’s smaller form factor products, including IoT, wearables, and portable devices. Wire bonding is an integral part of the […]

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Electronics manufacturing services providers who use conventional printed circuit board assembly and manufacturing models are scrambling to augment their production facilities to handle increasingly smaller boards like those used for IoT devices. At today’s advanced printed circuit board (PCB) houses, savvy leaders are homing in on newer technologies and merging conventional surface-mount technology manufacturing with […]

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IoT devices remain in their infancy, with a lot of questions being asked and experimenting going on. Radio frequency, or RF, is one technology that IoT companies and startups are dialing into to advance state-of-the-art IoT and, in doing so, increasing profit margins for their IoT products. In some cases, there are a lot of […]

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The demand for and technology of IoT devices are rapidly passing the consumer market and landing squarely in medical electronics, IT/enterprise, industrial and military markets. And those IoT markets are experiencing dramatic growth. However, those markets are highly demanding when it comes to high reliability. IoT devices in these instances must be reliable to the […]

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Requirements for Class III IoT devices are very specific. IoT applications falling into this category include mil/aero and medical electronics. In the assembly process for any type of PCB, either surface mount technology or through hole is used to place components onto an IoT rigid-flex or flex circuit. As the name implies, surface mount is […]

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Just like the big boys (meaning conventional printed circuit boards), IoT PCBs fall under the categories of Class I, II and III. Earlier, I noted that Class I IoT PCBs are pretty routine; those end applications cover virtually every consumer wearable you can think of. Class I IoT PCBs don’t demand a great measure of […]

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Wearable/IoT PCB technology is ushering in new design terminology and steps that need to be factored in. Two particular areas that need to be understood deals with (1) low and high modulus boards and (2) flex circuit bending. Board modulus refers to its structure; low modulus means a softer structure, while high modulus refers to […]

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