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The industry is increasingly moving toward PCB hybrid assembly involving both traditional SMT and microelectronics assembly and manufacturing. Using the right type of glob top epoxy represents one item that can be easily taken for granted and overlooked during microelectronics manufacturing. Fig. 1 shows an example of a clear epoxy glob top. These are the […]

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In my last column, I talked about protecting both the bare die and associated wire bonding as a major part of today’s PCB microelectronics assembly. I also discussed two die protection methodologies—glob top and lid and cover—as well as a glob top sub-method known as dam and fill. This column will further describe how you […]

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