Today’s PCB microelectronics assembly and manufacturing is still in its early stages and depending on who you talk to, it takes on different methods and procedures at different EMS providers. So, you can safely say that not all microelectronics assembly and manufacturing houses are alike. A good measure to determine if you have the right […]
Continue Reading...- 17
- Nov
- 2020
C4 or C2 Bumps in PCB Microelectronics?
C4 and C2 bumps for flipchip assemblies are among the top techniques that require close attention during PCB microelectronics assembly. Those two are flipchip (FC) bump connection techniques and are crucial for efficient and cost-effective microelectronics assembly. In short, C4 and C2 are interposers that connect a small die in a FCBGA, using flipchip on […]
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