The outlook appears promising in 2021 for electronics OEMs to bring some or most of their manufacturing back to the U.S. In particular, medical electronics OEMs may be able to move forward with their prototypes into pilot, medium, and high runs right here on American soil. And it may be sooner than later due in […]
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It has been a difficult year for families throughout the world and closer to home, for our friends, families and customers. On the bright side, we’re thankful that promising Covid-19 vaccines are on the horizon. If all goes well in 2021, we’ll be back to normal as much as possible. But in the meantime, despite […]
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- Oct
- 2020
FCBGA Comes Into PCB Microelectronics Assembly
OEMs and in particular medical equipment OEMs should become familiar with a packaging term now being introduced into PCB microelectronics assembly. This packaging involves a combination of flip-chip and BGA (FCBGA) packaging, Fig. 1. Figure 1: A BGA and a flip-chip interposer. (Source: Thorsten Meyer, Wikipedia, with minor modifications in red) FCBGA is critical due […]
Continue Reading...As I’ve said in earlier columns, the demand for smaller circuitry and packaging, as well as ever-shrinking PCB real estate, have continually pushed PCB assembly and manufacturing protocols. Newer, smaller, portable, and ingestible medical devices are opening new frontiers and are leading OEMs from other industries down that same road. Continue Reading at IConnect007
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Today, a growing number of OEMs have a sound understanding of how significant PCB hybrid manufacturing is for their new generation of products. That’s because their customers in the medical electronics, mil/aero, commercial, and industrial sectors are demanding greater electronics functionality in smaller, portable devices. This means those devices are based on smaller printed circuit […]
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