- 17
- Nov
- 2020
C4 or C2 Bumps in PCB Microelectronics?
C4 and C2 bumps for flipchip assemblies are among the top techniques that require close attention during PCB microelectronics assembly. Those two are flipchip (FC) bump connection techniques and are crucial for efficient and cost-effective microelectronics assembly. In short, C4 and C2 are interposers that connect a small die in a FCBGA, using flipchip on […]
Continue Reading...- 13
- Oct
- 2020
FCBGA Comes Into PCB Microelectronics Assembly
OEMs and in particular medical equipment OEMs should become familiar with a packaging term now being introduced into PCB microelectronics assembly. This packaging involves a combination of flip-chip and BGA (FCBGA) packaging, Fig. 1. Figure 1: A BGA and a flip-chip interposer. (Source: Thorsten Meyer, Wikipedia, with minor modifications in red) FCBGA is critical due […]
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As I’ve said in earlier columns, the demand for smaller circuitry and packaging, as well as ever-shrinking PCB real estate, have continually pushed PCB assembly and manufacturing protocols. Newer, smaller, portable, and ingestible medical devices are opening new frontiers and are leading OEMs from other industries down that same road. Continue Reading at IConnect007
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