die attach and wire bonding Archives - Nexlogic

You are here: Tag Archives: die attach and wire bonding

Home / Posts tagged "die attach and wire bonding"

The industry is increasingly moving toward PCB hybrid assembly involving both traditional SMT and microelectronics assembly and manufacturing. Using the right type of glob top epoxy represents one item that can be easily taken for granted and overlooked during microelectronics manufacturing. Fig. 1 shows an example of a clear epoxy glob top. These are the […]

Continue Reading...