Real estate continues to be a precious commodity for substrates, package sizes, dies, and PCBs. One thing stays constant, any way you look at it, and that constant is we continue to shrink the real estate as much as possible. Not long ago, package on package (PoP) was a top technology on the SMT manufacturing […]
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As PCB hybrid manufacturing makes greater inroads with microelectronics manufacturing, new inspection tools are coming to the fore. In our industry, microelectronics manufacturing is increasingly becoming the companion of traditional surface-mount technology (SMT) manufacturing due to the growing need for smaller form factors for printed circuit boards (PCBs), chips on board (CoB), flip chips, and […]
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Today, a growing number of OEMs have a sound understanding of how significant PCB hybrid manufacturing is for their new generation of products. That’s because their customers in the medical electronics, mil/aero, commercial, and industrial sectors are demanding greater electronics functionality in smaller, portable devices. This means those devices are based on smaller printed circuit […]
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