Wafer Processing - Nexlogic

Wafer Processing

Wafer Processing Services

  • Process different wafer sizes
  • Process material with different thicknesses
  • Produce beveled/ chamfered cuts with customer defined angles
  • Bumped and non-bumped wafers
  • Trench cuts, plunge cuts, and curved cuts
  • Dicing, Polishing and Grinding Wafers

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