Wafer Manufacturing

Wafer Manufacturing steps generally include:

• Slicing
• Lapping
• Etching
• Polishing
• The Silicon Crystal is Sliced by Using a Diamond-Tipped Saw into Thin Wafers
• Sorted by Thickness
• Damaged Wafers Removed During Lapping
• Etch Wafers in Chemical to Remove any Remaining Crystal Damage
• Polishing Smoothens Uneven Surface Left by Sawing Process