Wafer Manufacturing - Nexlogic

Wafer Manufacturing

Wafer Manufacturing steps generally include:

  • Slicing
  • Lapping
  • Etching
  • Polishing
  • The Silicon Crystal is Sliced by Using a Diamond-Tipped Saw into Thin Wafers
  • Sorted by Thickness
  • Damaged Wafers Removed During Lapping
  • Etch Wafers in Chemical to Remove any Remaining Crystal Damage
  • Polishing Smoothens Uneven Surface Left by Sawing Process

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