Wafer Manufacturing
Wafer Manufacturing steps generally include:
- Slicing
- Lapping
- Etching
- Polishing
- The Silicon Crystal is Sliced by Using a Diamond-Tipped Saw into Thin Wafers
- Sorted by Thickness
- Damaged Wafers Removed During Lapping
- Etch Wafers in Chemical to Remove any Remaining Crystal Damage
- Polishing Smoothens Uneven Surface Left by Sawing Process