System in Package - Nexlogic

System in Package

A system in package, or SiP, which can also be called a Multi-Chip Module (MCM), is an electronic device is a way of bundling two or more ICs inside a single package. SiP has been around since the 80’s in the form of multi-chip modules. Instead if assembling multiple IC’s (Chips) on a PCB, they can be combined into the same package to lower cost or to shorten distances that electrical signals have to travel. Connections historically have been through wire bonds.

A SiP integrates multiple Integrated Circuits (ICs) along with their supporting passive devices into a single package. It leverages semiconductor manufacturing processes and bare silicon die to create a tightly coupled module. It is a system by design and a component by construction

While SiP is becoming popular these days, there has been much work done on improving this concept recently as well as package-on-package and flip-chips. There are several key drivers for these changes:

  1. Analog IP doesn’t shrink as easily as digital circuits from one process node to the other. Being able to shrink just the digital portions and keep analog at older process geometries is increasingly attractive, but it also requires some sophisticated communication between dies.
  2. Shrinking features and adding more functionality onto semiconductors requires longer and thinner wires, which increases the time it takes for signals to move around a chip. By packaging different chips together, connected through an interposer or through-silicon via, those signals can be speeded up using shorter wire distances and wider conduits.

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