Packaging Evolution - Nexlogic

Packaging Evolution

In the semiconductor manufacturing process, packaging has exploded with innovation and complexity along with expanded functionality. In particular, wafer-level packaging has experienced tremendous advancements in materials, processes, and equipment, enabling WLP to become one of the fastest growing chip packaging technologies.

Bumping, redistribution layers, fan out, through-silicon vias, and other techniques have contributed to the small-form-factor chips with powerful, high-speed functionality that we consumers expect in our mobile electronics, portable devices and in IoT technologies.

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