PCB Assembly Capabilities - NexLogic Technologies

PCB Assembly Capabilities

View PCB Assembly Flowchart


  • SMT & Through-hole
  • High Speed Placement
  • BGA and Micro-BGA Capabilities
    • CSP (Chip Scale Packaging)
    • Flip Chip
    • X-Ray Verification
    • Reballing
    • Rework (De-population and Re-population)
    • Same Day and Next Day Service
  • Fine Pitch
  • 01005 Placement
  • Optimized Reflow Profiling
  • Turnkey or Consigned Kits
  • Press Fit Connectors
  • Quick-Turn Assemblies (Same Day & Next Day)
  • Prototype Quantities
  • Production Quantities w/ Scheduled Deliveries
  • High Volume Production
  • Double-Sided SMT
  • De-ionized Wash
  • Rework Capabilities
    • De-population and Re-population
    • Fine Pitch
    • Cuts & Jumps
    • Piggybacks & Teepees
    • Minor PCB Repair
    • Same Day & Next Day Service
  • IPC-A-610 Class III Certified
  • Strict ESD Control
  • Mechanical Assembly and Box Builds
  • Work closely w/ In-House Design Team on DFM and DFT Issues
  • Cable & Harness Assembly
  • Functional Testing

Overseas Manufacturing / High Volume Manufacturing

Although most production orders are manufactured locally, we’ve acknowledged the special needs of some of our customers. Our strategic partnerships give you the benefits you’d expect from offshore manufacturing. For all your PCB Assembly needs, feel free to contact us for more information.

To learn more about Assembly Capabilities, visit our Mixed Assembly Placement page.

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