Pb Free Assembly and Design - Pb Free Fabrication - NexLogic

NexLogic: The Pb-free Transition Team

There is growing confusion among OEMs over a variety of issues and technologies aimed at resolving Pb-free concerns, particularly Pb-free solder joint reliability. An efficient, prudent route for the OEM to take to quell these perplexing areas is to work in tandem with an EMS provider, like NexLogic Technologies, that is capable of providing transitional expertise to guide OEM engineering through these issues and potential pitfalls. In effect, an arrangement like this can be an extension of your R&D, and an EMS provider can serve as your Pb-free lab to run different processes. By taking this direction, OEMs are alleviated of carrying excessive engineering overhead in their quest for attaining Pb-free solder joint and assembly reliability.

NexLogic Technologies has an ideal Pb-free transition team with trained personnel in purchasing, inventory management, fabrication, and process control. Purchasing and procurement specialists are sufficiently versatile to fully understand and track a variety of changing conventions associated with Pb-free assembly. Inventory personnel understand differences between eutectic and Pb-free components. Particularly, they are attentive to the adverse consequences of mistaking one for the other. Plus, they maintain stringent control over incoming vendor components from a variety of supplier bases and once in house, segregate those components and maintain proper inventory of them.

Fabrication engineers and technicians at NexLogic are well versed in all the differences, tradeoffs, advantages, and disadvantages of an array of Pb-free PCB surface finishes. Lastly, process engineers on a Pb-free transition team are trained to know the differences and effects of Pb and Pb-free thermal profiles and which ones to use to avoid catastrophic results.

Accordingly, when transitioning to Pb-free, OEM concerns should focus on such major areas as PCB surface finishes, solder paste, accurate process controls, newer and different thermal profiles, and precise rework.

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