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So far, I’ve discussed a variety of PCB microelectronics subjects. However, I haven’t covered one of the most crucial areas: PCB fabrication that creates the circuit board undergoing microelectronics assembly. OEMs need to carefully consider fabrication for their products that are assembled via the PCB microelectronics route. The burning question is, “Why is fabrication vitally […]

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Electronic systems and equipment OEMs have historically pushed for greater functional integration. This means putting more electronic power on increasingly smaller chips, as well as making sub-assemblies even smaller. All this goes under the banner of increasing performance and decreasing cost. This is truer today for IoT devices than ever before. Continue Reading at IoT […]

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“Take an aspirin and call me tomorrow,” is the proverbial, jovial, and often-cited elixir that doctors have prescribed over the years for whatever ails you. Today, medical electronics are adopting the same concept but with new technologies. Now, the phrase, “Take an aspirin,” takes on new meaning, as medical electronics move into new frontiers of […]

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Ideally, OEMs should crave as much functionality as possible out of a chip or die. The chipmaker has done its job to produce ultra-functionality for a given chip generation via its design and manufacturing. But would you believe that there’s still more functionality to glean out of that chip? That’s where multi-tier wire-bonding steps into […]

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Tech companies are talking about designing IoT devices with AI and machine learning. Before getting there, IoT device OEMs must take a couple of steps back and assure themselves of effective printed circuit board microelectronics assembly and manufacturing as an initial step to assure product integrity and reliability. An item such as using the right […]

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In my last column, I talked about protecting both the bare die and associated wire bonding as a major part of today’s PCB microelectronics assembly. I also discussed two die protection methodologies—glob top and lid and cover—as well as a glob top sub-method known as dam and fill. This column will further describe how you […]

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As IoT devices gain greater acceptance within mission-critical industries such as industrial, medical and aerospace, product integrity and reliability are of the highest order. Bare chip or die protection is at the top of the list for ensuring IoT reliability and product integrity. IoT devices — in most instances — are based on factors requiring […]

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As PCB hybrid manufacturing makes greater inroads with microelectronics manufacturing, new inspection tools are coming to the fore. In our industry, microelectronics manufacturing is increasingly becoming the companion of traditional surface-mount technology (SMT) manufacturing due to the growing need for smaller form factors for printed circuit boards (PCBs), chips on board (CoB), flip chips, and […]

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Protecting bare dies on a PCB or substrate is a major process of microelectronics assembly. As we’ve said before, microelectronics assembly and manufacturing work in tandem with traditional SMT manufacturing for complete PCB hybrid manufacturing of today’s smaller form factor products, including IoT, wearables, and portable devices. Wire bonding is an integral part of the […]

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Electronics manufacturing services providers who use conventional printed circuit board assembly and manufacturing models are scrambling to augment their production facilities to handle increasingly smaller boards like those used for IoT devices. At today’s advanced printed circuit board (PCB) houses, savvy leaders are homing in on newer technologies and merging conventional surface-mount technology manufacturing with […]

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