Technical Publications Archives - Nexlogic

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Electronics manufacturing services providers who use conventional printed circuit board assembly and manufacturing models are scrambling to augment their production facilities to handle increasingly smaller boards like those used for IoT devices. At today’s advanced printed circuit board (PCB) houses, savvy leaders are homing in on newer technologies and merging conventional surface-mount technology manufacturing with […]

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Microelectronics manufacturing is the companion of SMT manufacturing and forms PCB hybrid manufacturing. Tools for SMT manufacturing have been around for a long time and have proven their value. Now, with microelectronics, new and different types of high-powered laser microscopes are populating the microelectronics assembly and manufacturing area to provide highly effective inspection and calibration. […]

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Today, hybrid PCB manufacturing is making greater inroads into our industry, which is the marriage of traditional SMT manufacturing together with microelectronics and wire bonding. In many cases, the OEM working with EMS providers doesn’t fully understand the nuances of effective wire bonding and related failures. What has to be considered with new hybrid manufacturing […]

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There is no big secret. PCB manufacturing is changing now more than ever before in its long history. Initially, it involved through-hole assembly and manufacturing with the most notable Intel 8086 motherboard. Later, through-hole and surface mount technology (SMT) began merging and sustained a long product cycle. But today, PCB manufacturing is rapidly evolving to […]

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Smaller PCBs, including rigid-flex circuits, call for die attach using one of three methodologies, depending on the application. Technologies that for years were the sole domain of semiconductor manufacturing have now migrated into today’s printed circuit board (PCB) manufacturing processes and flows. These are not the old, traditional PCBs that we’ve grown up with; instead, […]

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If you’re developing, producing or selling IoT devices, it might be a good idea for you to get acquainted with the term anisotropic conductive film, or ACF for short. You don’t hear much about it. However, it plays a big role in the manufacture of small printed circuit boards (PCBs), especially when IoT products are […]

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Zulki Khan, founder and CEO of NexLogic Technologies, discusses challenges, technology trends, and developments in the medical electronics industry from PCB design to fabrication and assembly. He also highlights key considerations when finding a manufacturing partner for your medical electronics products. Continue Reading

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For EMS providers and contract manufacturers, the International Standards Organization (ISO) 13485 Standard provides a considerable number of challenges. They all fall under the main category of quality management systems for medical electronics products. But now there is a new wrinkle associated with ISO 13485; this wrinkle isn’t in the books and is rarely spoken […]

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Earlier we talked about wire bond testing for IoT printed circuit boards and the types of wire used to connect a bare chip to a substrate or the PCB surface itself. This discussion deals with wire bond loops pull testing and verification, which is critical for IoT device reliability. Your immediate reaction is probably: What […]

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My last post dealt with IoT printed circuit board wire bond reliability and making sure wire bond connections are properly performed between a bare chip and the PCB or substrate. Beyond that particular subject, there is also so much more technology associated with IoT devices and reliability. Die shear strength is one area demanding increasing […]

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