Technical Publications Archives - Nexlogic

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A unique thermal profile is designed for each PCB job undergoing conventional SMT assembly, as virtually every PCB assembly professional knows. But what about a PCB assembly project involving both conventional rigid board and an extraordinarily small rigid or rigid-flex circuit undergoing microelectronics assembly? In short, that’s called PCB hybrid assembly, which requires two separate, […]

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The electronics industry is fertile ground for innovation these days, powering the creation of intriguing new products across sectors like the internet of things (IoT), autonomous vehicles, wearable devices, and microelectronics for implantable medical devices. In one instance, research engineers at Purdue have reportedly come up with a powerful transistor that can perform double duty: […]

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IoT devices are entering a distinctly new realm when it comes to printed circuit board (PCB) assembly. The reason for that is IoT devices require both traditional surface mount technology (SMT) assembly, as well as microelectronics assembly. The latter involves chip on board, wire bonding, die attach, flip chip and other associated technologies. Continue Reading […]

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Seven major steps need to be taken to achieve successful SMT and microelectronics assembly for medical electronic devices. These key steps take on special significance for newly emerging implantable and ingestible medical devices and result in medical devices that are robust, smaller, highly reliable, more powerful, and lighter. Deploy the right ancillary devices, such as […]

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So far, I’ve discussed a variety of PCB microelectronics subjects. However, I haven’t covered one of the most crucial areas: PCB fabrication that creates the circuit board undergoing microelectronics assembly. OEMs need to carefully consider fabrication for their products that are assembled via the PCB microelectronics route. The burning question is, “Why is fabrication vitally […]

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Electronic systems and equipment OEMs have historically pushed for greater functional integration. This means putting more electronic power on increasingly smaller chips, as well as making sub-assemblies even smaller. All this goes under the banner of increasing performance and decreasing cost. This is truer today for IoT devices than ever before. Continue Reading at IoT […]

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“Take an aspirin and call me tomorrow,” is the proverbial, jovial, and often-cited elixir that doctors have prescribed over the years for whatever ails you. Today, medical electronics are adopting the same concept but with new technologies. Now, the phrase, “Take an aspirin,” takes on new meaning, as medical electronics move into new frontiers of […]

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Ideally, OEMs should crave as much functionality as possible out of a chip or die. The chipmaker has done its job to produce ultra-functionality for a given chip generation via its design and manufacturing. But would you believe that there’s still more functionality to glean out of that chip? That’s where multi-tier wire-bonding steps into […]

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Tech companies are talking about designing IoT devices with AI and machine learning. Before getting there, IoT device OEMs must take a couple of steps back and assure themselves of effective printed circuit board microelectronics assembly and manufacturing as an initial step to assure product integrity and reliability. An item such as using the right […]

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In my last column, I talked about protecting both the bare die and associated wire bonding as a major part of today’s PCB microelectronics assembly. I also discussed two die protection methodologies—glob top and lid and cover—as well as a glob top sub-method known as dam and fill. This column will further describe how you […]

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