Technical Publications Archives - Nexlogic

You are here: Category Archives: Technical Publications

Home / Archive by category "Technical Publications"

In my last column, I talked about protecting both the bare die and associated wire bonding as a major part of today’s PCB microelectronics assembly. I also discussed two die protection methodologies—glob top and lid and cover—as well as a glob top sub-method known as dam and fill. This column will further describe how you […]

Continue Reading...

As IoT devices gain greater acceptance within mission-critical industries such as industrial, medical and aerospace, product integrity and reliability are of the highest order. Bare chip or die protection is at the top of the list for ensuring IoT reliability and product integrity. IoT devices — in most instances — are based on factors requiring […]

Continue Reading...

As PCB hybrid manufacturing makes greater inroads with microelectronics manufacturing, new inspection tools are coming to the fore. In our industry, microelectronics manufacturing is increasingly becoming the companion of traditional surface-mount technology (SMT) manufacturing due to the growing need for smaller form factors for printed circuit boards (PCBs), chips on board (CoB), flip chips, and […]

Continue Reading...

Protecting bare dies on a PCB or substrate is a major process of microelectronics assembly. As we’ve said before, microelectronics assembly and manufacturing work in tandem with traditional SMT manufacturing for complete PCB hybrid manufacturing of today’s smaller form factor products, including IoT, wearables, and portable devices. Wire bonding is an integral part of the […]

Continue Reading...

Electronics manufacturing services providers who use conventional printed circuit board assembly and manufacturing models are scrambling to augment their production facilities to handle increasingly smaller boards like those used for IoT devices. At today’s advanced printed circuit board (PCB) houses, savvy leaders are homing in on newer technologies and merging conventional surface-mount technology manufacturing with […]

Continue Reading...
Post Image

Microelectronics manufacturing is the companion of SMT manufacturing and forms PCB hybrid manufacturing. Tools for SMT manufacturing have been around for a long time and have proven their value. Now, with microelectronics, new and different types of high-powered laser microscopes are populating the microelectronics assembly and manufacturing area to provide highly effective inspection and calibration. […]

Continue Reading...

Today, hybrid PCB manufacturing is making greater inroads into our industry, which is the marriage of traditional SMT manufacturing together with microelectronics and wire bonding. In many cases, the OEM working with EMS providers doesn’t fully understand the nuances of effective wire bonding and related failures. What has to be considered with new hybrid manufacturing […]

Continue Reading...

There is no big secret. PCB manufacturing is changing now more than ever before in its long history. Initially, it involved through-hole assembly and manufacturing with the most notable Intel 8086 motherboard. Later, through-hole and surface mount technology (SMT) began merging and sustained a long product cycle. But today, PCB manufacturing is rapidly evolving to […]

Continue Reading...

Smaller PCBs, including rigid-flex circuits, call for die attach using one of three methodologies, depending on the application. Technologies that for years were the sole domain of semiconductor manufacturing have now migrated into today’s printed circuit board (PCB) manufacturing processes and flows. These are not the old, traditional PCBs that we’ve grown up with; instead, […]

Continue Reading...

If you’re developing, producing or selling IoT devices, it might be a good idea for you to get acquainted with the term anisotropic conductive film, or ACF for short. You don’t hear much about it. However, it plays a big role in the manufacture of small printed circuit boards (PCBs), especially when IoT products are […]

Continue Reading...