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We can all agree that 2019 brought us many blessings, and we’re all thankful. As we gather this Holiday season with friends and family, we’re looking at 2020 as yet another year with great hope and opportunities. From NexLogic, we wish you, your employees, friends, colleagues, and families a happy holiday season, good health, and […]

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If you’ve been reading current medical journals and papers, you know that medical electronics is entering into a new frontier where PCB assembly and manufacturing hasn’t been before. Leading medical electronics OEMs and top healthcare centers are forging ahead with so-called ingestible smart pills and smart cameras that promise to replace large, conventional medical systems. […]

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The industry is increasingly moving toward PCB hybrid assembly involving both traditional SMT and microelectronics assembly and manufacturing. Using the right type of glob top epoxy represents one item that can be easily taken for granted and overlooked during microelectronics manufacturing. Fig. 1 shows an example of a clear epoxy glob top. These are the […]

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Why is it important to protect bare dies after wire bonding especially when your product is undergoing PCB microelectronics assembly? The answer comes in two parts. One, you need to protect the die for mechanical sturdiness. Two, moisture can at times creep in to create corrosion or oxidation surface finish. Therefore, both the die and […]

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The world of electronics has reached a new dimension in terms of preciseness. That is now occurring in PCB microelectronics manufacturing with the onset of infinitesimal measurement and calibration of a variety of assembly tasks associated with PCB microelectronics. Recall from our earlier writings that PCB microelectronics manufacturing is a companion to traditional SMT manufacturing, […]

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Wire bonding as a central focus for PCB microelectronics manufacturing demands considerable attention as part of the overall PCB hybrid manufacturing. In particular, wire bond loops and their pull strength for reliability and integrity are critically important. Those wire bond loops must be accurately and correctly calculated, formed and executed on the microelectronics manufacturing floor […]

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Today, a growing number of OEMs have a sound understanding of how significant PCB hybrid manufacturing is for their new generation of products. That’s because their customers in the medical electronics, mil/aero, commercial, and industrial sectors are demanding greater electronics functionality in smaller, portable devices. This means those devices are based on smaller printed circuit […]

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Image source: https://en.wikipedia.org/wiki/Interposer

A number of new terms are entering into today’s PCB discussions. Most of these terms involve those PCBs that continue to shrink, use smaller packaged devices, and have limited real estate. The term, “interposer” is among the newest ones joining such other new terms as PCB hybrid manufacturing, microelectronics, die attach, wire bonding, and others. […]

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Over time, PCB manufacturing has evolved from the traditional through hole, to through hole combined with SMT, and today, a growing number of PCBs are assembled with a combination of SMT and microelectronics or bare die wire bonded onto a substrate or the PCB, itself. Die attach is an integral part of microelectronics. In 2019 […]

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Wire bonding reliability is certainly critical in PCB microelectronics/wire bonding manufacturing. Wire bond integrity is also related to the reliability of a successful and accurate wire bond. In this particular case, there is actual testing to assure the integrity of wire bonding. It’s called wire bonding pull testing. Pull testing performs several methodologies to test […]

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