Category Archives: Resource Center

Understand Wire Bond Loops and ACF

Two major PCB technologies are gaining more attention on the manufacturing floor. Those are wire bonding loops and anisotropic conductive film or ACF, both are especially associated with smaller PCBs. The industry is placing greater emphasis on these smaller boards and rigid-flex circuits for a growing number of PCB applications in the industrial, mil/aero, medical, […]

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Wire Bonding Set for Small Medical Electronics PCBs

The ISO 13485 Standard is synonymous with quality and reliability for medical electronics products. Wire bonding is the newest technology coming on to the PCB assembly floor, and its basic requirements are for high quality and reliability to further support ISO 13485. This renewed call for quality and reliability in wire bonding is emerging due […]

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Get the Know How On Wire Bonding Reliability

Wire bonding has traveled far and wide from the early days of semiconductor manufacturing. That’s when wire bonding was used to connect a chip to a package, like the early, early days of dual-in-line (DIP) ceramic and plastic packaging. But today, wire bonding is being performed in microelectronics cleanrooms in PCB assembly and manufacturing areas. […]

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Understand Wire Bonding and Die Shear Testing

Wire bonding, as shown in Fig. 1, and die shear strength training are inextricably intertwined. Die shear strength is a demanding aspect of wire bonding to assure top quality and reliability to comply with Mil STD 883, Rev. G or Rev. F. In particular, wire bonding and die shear strength testing play prominent roles for […]

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Get On the Right Wavelength for RF

RF circuits are designed to pass signals within a certain band. They use band pass filters to transmit signals in a so-called band of interest. The signal within a range of frequency passes through this band range, and the rest of the frequencies of the signal are filtered. A single band can be very narrow […]

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Get An Understanding of Wire Bonding Reliability

Wire bonding has been inextricably linked to semiconductor assembly and connecting the chip with its package. Today, wire bonding technology is used in PCB assembly simply because OEM demands are for increasingly smaller products and the boards they’re based on. Products like IoT devices and wearables are based on small rigid or a combination of […]

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Taking Another Look At ISO 13485

ISO 13485 is about potential risks involved and mitigating them during and after the building of medical products. It is a specific ISO standard serving as a comprehensive management system for the design and manufacture of medical devices. Like other ISO standards, its focus is on continuous improvement in process and quality systems. Also, a […]

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NexLogic Technologies, Inc. Named Among Top 10 EMS Providers in Silicon Valley by VentureOutsource

NexLogic Technologies, Inc. is a full service EMS Provider including printed circuit board (PCB) design, fabrication, assembly and manufacturing, and microelectronics assemblies. The company serves commercial, mil/aero, medical electronics, and consumer markets. Its OEM, ODM and semiconductor company customers partner with NexLogic on their conventional, automatic testing equipment (ATE), wearable, and IoT PCBs. Continue reading

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Stay Up with Thermal Profiling For Smaller and Smaller PCBs

When you think printed circuit boards (PCBs) cannot get any smaller, they continue to do so, especially in this day and age when IoT devices are springing up everywhere. See Fig. 1 for examples of denser and smaller PCBs. The smaller the PCB, the more challenges associated with creating the correct thermal profiles. It’s especially […]

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Take a New Look at AOI

Automated optical inspection (AOI) systems represent a prime example of the valuable and effective equipment demanded on today’s assembly floor. The foremost reason is the extraordinarily small component packaging and ever-shrinking PCB size that require the most sophisticated AOI solutions possible to detect flaws and defects during the assembly process. AOI is well suited for […]

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