nexlogic, Author at Nexlogic

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We can all agree that 2019 brought us many blessings, and we’re all thankful. As we gather this Holiday season with friends and family, we’re looking at 2020 as yet another year with great hope and opportunities. From NexLogic, we wish you, your employees, friends, colleagues, and families a happy holiday season, good health, and […]

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“Take an aspirin and call me tomorrow,” is the proverbial, jovial, and often-cited elixir that doctors have prescribed over the years for whatever ails you. Today, medical electronics are adopting the same concept but with new technologies. Now, the phrase, “Take an aspirin,” takes on new meaning, as medical electronics move into new frontiers of […]

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Ideally, OEMs should crave as much functionality as possible out of a chip or die. The chipmaker has done its job to produce ultra-functionality for a given chip generation via its design and manufacturing. But would you believe that there’s still more functionality to glean out of that chip? That’s where multi-tier wire-bonding steps into […]

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If you’ve been reading current medical journals and papers, you know that medical electronics is entering into a new frontier where PCB assembly and manufacturing hasn’t been before. Leading medical electronics OEMs and top healthcare centers are forging ahead with so-called ingestible smart pills and smart cameras that promise to replace large, conventional medical systems. […]

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Tech companies are talking about designing IoT devices with AI and machine learning. Before getting there, IoT device OEMs must take a couple of steps back and assure themselves of effective printed circuit board microelectronics assembly and manufacturing as an initial step to assure product integrity and reliability. An item such as using the right […]

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The industry is increasingly moving toward PCB hybrid assembly involving both traditional SMT and microelectronics assembly and manufacturing. Using the right type of glob top epoxy represents one item that can be easily taken for granted and overlooked during microelectronics manufacturing. Fig. 1 shows an example of a clear epoxy glob top. These are the […]

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In my last column, I talked about protecting both the bare die and associated wire bonding as a major part of today’s PCB microelectronics assembly. I also discussed two die protection methodologies—glob top and lid and cover—as well as a glob top sub-method known as dam and fill. This column will further describe how you […]

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Why is it important to protect bare dies after wire bonding especially when your product is undergoing PCB microelectronics assembly? The answer comes in two parts. One, you need to protect the die for mechanical sturdiness. Two, moisture can at times creep in to create corrosion or oxidation surface finish. Therefore, both the die and […]

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As IoT devices gain greater acceptance within mission-critical industries such as industrial, medical and aerospace, product integrity and reliability are of the highest order. Bare chip or die protection is at the top of the list for ensuring IoT reliability and product integrity. IoT devices — in most instances — are based on factors requiring […]

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As PCB hybrid manufacturing makes greater inroads with microelectronics manufacturing, new inspection tools are coming to the fore. In our industry, microelectronics manufacturing is increasingly becoming the companion of traditional surface-mount technology (SMT) manufacturing due to the growing need for smaller form factors for printed circuit boards (PCBs), chips on board (CoB), flip chips, and […]

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