nexlogic, Author at Nexlogic

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Over time, PCB manufacturing has evolved from the traditional through hole, to through hole combined with SMT, and today, a growing number of PCBs are assembled with a combination of SMT and microelectronics or bare die wire bonded onto a substrate or the PCB, itself. Die attach is an integral part of microelectronics. In 2019 […]

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Smaller PCBs, including rigid-flex circuits, call for die attach using one of three methodologies, depending on the application. Technologies that for years were the sole domain of semiconductor manufacturing have now migrated into today’s printed circuit board (PCB) manufacturing processes and flows. These are not the old, traditional PCBs that we’ve grown up with; instead, […]

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Wire bonding reliability is certainly critical in PCB microelectronics/wire bonding manufacturing. Wire bond integrity is also related to the reliability of a successful and accurate wire bond. In this particular case, there is actual testing to assure the integrity of wire bonding. It’s called wire bonding pull testing. Pull testing performs several methodologies to test […]

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Two major PCB technologies are gaining more attention on the manufacturing floor. Those are wire bonding loops and anisotropic conductive film or ACF, both are especially associated with smaller PCBs. The industry is placing greater emphasis on these smaller boards and rigid-flex circuits for a growing number of PCB applications in the industrial, mil/aero, medical, […]

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If you’re developing, producing or selling IoT devices, it might be a good idea for you to get acquainted with the term anisotropic conductive film, or ACF for short. You don’t hear much about it. However, it plays a big role in the manufacture of small printed circuit boards (PCBs), especially when IoT products are […]

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The ISO 13485 Standard is synonymous with quality and reliability for medical electronics products. Wire bonding is the newest technology coming on to the PCB assembly floor, and its basic requirements are for high quality and reliability to further support ISO 13485. This renewed call for quality and reliability in wire bonding is emerging due […]

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Zulki Khan, founder and CEO of NexLogic Technologies, discusses challenges, technology trends, and developments in the medical electronics industry from PCB design to fabrication and assembly. He also highlights key considerations when finding a manufacturing partner for your medical electronics products. Continue Reading

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For EMS providers and contract manufacturers, the International Standards Organization (ISO) 13485 Standard provides a considerable number of challenges. They all fall under the main category of quality management systems for medical electronics products. But now there is a new wrinkle associated with ISO 13485; this wrinkle isn’t in the books and is rarely spoken […]

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Earlier we talked about wire bond testing for IoT printed circuit boards and the types of wire used to connect a bare chip to a substrate or the PCB surface itself. This discussion deals with wire bond loops pull testing and verification, which is critical for IoT device reliability. Your immediate reaction is probably: What […]

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Wire bonding has traveled far and wide from the early days of semiconductor manufacturing. That’s when wire bonding was used to connect a chip to a package, like the early, early days of dual-in-line (DIP) ceramic and plastic packaging. But today, wire bonding is being performed in microelectronics cleanrooms in PCB assembly and manufacturing areas. […]

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