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The industry is increasingly moving toward PCB hybrid assembly involving both traditional SMT and microelectronics assembly and manufacturing. Using the right type of glob top epoxy represents one item that can be easily taken for granted and overlooked during microelectronics manufacturing. Fig. 1 shows an example of a clear epoxy glob top. These are the […]

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In my last column, I talked about protecting both the bare die and associated wire bonding as a major part of today’s PCB microelectronics assembly. I also discussed two die protection methodologies—glob top and lid and cover—as well as a glob top sub-method known as dam and fill. This column will further describe how you […]

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Why is it important to protect bare dies after wire bonding especially when your product is undergoing PCB microelectronics assembly? The answer comes in two parts. One, you need to protect the die for mechanical sturdiness. Two, moisture can at times creep in to create corrosion or oxidation surface finish. Therefore, both the die and […]

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As IoT devices gain greater acceptance within mission-critical industries such as industrial, medical and aerospace, product integrity and reliability are of the highest order. Bare chip or die protection is at the top of the list for ensuring IoT reliability and product integrity. IoT devices — in most instances — are based on factors requiring […]

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As PCB hybrid manufacturing makes greater inroads with microelectronics manufacturing, new inspection tools are coming to the fore. In our industry, microelectronics manufacturing is increasingly becoming the companion of traditional surface-mount technology (SMT) manufacturing due to the growing need for smaller form factors for printed circuit boards (PCBs), chips on board (CoB), flip chips, and […]

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Protecting bare dies on a PCB or substrate is a major process of microelectronics assembly. As we’ve said before, microelectronics assembly and manufacturing work in tandem with traditional SMT manufacturing for complete PCB hybrid manufacturing of today’s smaller form factor products, including IoT, wearables, and portable devices. Wire bonding is an integral part of the […]

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The world of electronics has reached a new dimension in terms of preciseness. That is now occurring in PCB microelectronics manufacturing with the onset of infinitesimal measurement and calibration of a variety of assembly tasks associated with PCB microelectronics. Recall from our earlier writings that PCB microelectronics manufacturing is a companion to traditional SMT manufacturing, […]

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Electronics manufacturing services providers who use conventional printed circuit board assembly and manufacturing models are scrambling to augment their production facilities to handle increasingly smaller boards like those used for IoT devices. At today’s advanced printed circuit board (PCB) houses, savvy leaders are homing in on newer technologies and merging conventional surface-mount technology manufacturing with […]

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Microelectronics manufacturing is the companion of SMT manufacturing and forms PCB hybrid manufacturing. Tools for SMT manufacturing have been around for a long time and have proven their value. Now, with microelectronics, new and different types of high-powered laser microscopes are populating the microelectronics assembly and manufacturing area to provide highly effective inspection and calibration. […]

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Wire bonding as a central focus for PCB microelectronics manufacturing demands considerable attention as part of the overall PCB hybrid manufacturing. In particular, wire bond loops and their pull strength for reliability and integrity are critically important. Those wire bond loops must be accurately and correctly calculated, formed and executed on the microelectronics manufacturing floor […]

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