Sub-Micron Die Bonding—Don’t Be Misled by Five Micron Placement Standard

OEMs launching micro-miniature products and relying on PCB microelectronics assembly and manufacturing to help produce those products may find themselves in a quandary.

Let’s think about this. The industry standard for accuracy right now for placement of MEMS devices, sensors, biosensors, or other kinds of pressure sensors is five-micron placement accuracy on a very small rigid or rigid-flex board. If you place a die on a tiny circuit board, it will be placed with plus or minus five-micron accuracy based on the majority of die bonding machines on today’s assembly and manufacturing floors. Continue Reading at IConnect007