Wire Bonding and CoB for PCB Microelectronics Assembly

Real estate continues to be a precious commodity for substrates, package sizes, dies, and PCBs. One thing stays constant, any way you look at it, and that constant is we continue to shrink the real estate as much as possible.

Not long ago, package on package (PoP) was a top technology on the SMT manufacturing floor. With PoP, you stack one component on top of another and then on top of another. That was one way of dealing with the assembly challenges of a shrinking PCB real estate. However, with PoP, OEMs and manufacturers are struggling with stability and reliability. Continue Reading at IConnect007