3 key steps for IoT PCB SMT and microelectronics assembly - Nexlogic
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IoT devices are entering a distinctly new realm when it comes to printed circuit board (PCB) assembly. The reason for that is IoT devices require both traditional surface mount technology (SMT) assembly, as well as microelectronics assembly. The latter involves chip on board, wire bonding, die attach, flip chip and other associated technologies.
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