Seven major steps need to be taken to achieve successful SMT and microelectronics assembly for medical electronic devices. These key steps take on special significance for newly emerging implantable and ingestible medical devices and result in medical devices that are robust, smaller, highly reliable, more powerful, and lighter.
- Deploy the right ancillary devices, such as tooling, fixtures, and jigs.
- Decide which process to perform first: SMT or microelectronics.
- Protect sensitive microelectronics areas.
- Properly use epoxies.
- Consider conductive vs. non-conductive epoxy applications.
- Address thermal profiling and heat dissipation.
- Maintain records, inspection tools, and reliability analyses
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