Zulki's PCB Nuggets: Multi-tier Wire Bonding - Diving Into PCB Microelectronics - Nexlogic
Home / Technical Publications / Zulki’s PCB Nuggets: Multi-tier Wire Bonding – Diving Into PCB Microelectronics

Ideally, OEMs should crave as much functionality as possible out of a chip or die. The chipmaker has done its job to produce ultra-functionality for a given chip generation via its design and manufacturing. But would you believe that there’s still more functionality to glean out of that chip? That’s where multi-tier wire-bonding steps into PCB microelectronics assembly to do exactly that—extract more functionality out of that already powerful chip.

But there’s more. Multi-tier wire bonding also gives OEMs the opportunity to reduce the PCB’s size, meaning less cost, yet more value. Instead of using multiple dies and single wire bonding, a single die can be combined with multi-tier bonding to capture that extra functionality; at the same time, this can reduce the number of dies required for a given application, thus decreasing the PCB’s size.

Continue Reading at iConnect 007.