Tech companies are talking about designing IoT devices with AI and machine learning. Before getting there, IoT device OEMs must take a couple of steps back and assure themselves of effective printed circuit board microelectronics assembly and manufacturing as an initial step to assure product integrity and reliability.
An item such as using the right epoxy during printed circuit board (PCB) microelectronics assembly might sound mundane to less savvy PCB assembly and manufacturing engineers. An inexperienced process engineer on the assembly floor might just shrug it off during the epoxy selection process and inadvertently chose the wrong one. That leads to the highest probability of subsequent product failure or delayed latent field failures.
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