Zulki’s PCB Nuggets: Protect the Die and Wire Bonding for Effective PCB Microelectronics Assembly - Nexlogic
Home / Technical Publications / Zulki’s PCB Nuggets: Protect the Die and Wire Bonding for Effective PCB Microelectronics Assembly

Protecting bare dies on a PCB or substrate is a major process of microelectronics assembly. As we’ve said before, microelectronics assembly and manufacturing work in tandem with traditional SMT manufacturing for complete PCB hybrid manufacturing of today’s smaller form factor products, including IoT, wearables, and portable devices.

Wire bonding is an integral part of the microelectronics assembly. It comes into play after attaching a die to a PCB; ceramic, glass, or aluminum substrate; or a rigid, flex, or combination rigid-flex circuit. Then, it’s wire-bonded using fine wires.

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