Protect IoT bare dies and wire bonds for high reliability - Nexlogic
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As IoT devices gain greater acceptance within mission-critical industries such as industrial, medical and aerospace, product integrity and reliability are of the highest order. Bare chip or die protection is at the top of the list for ensuring IoT reliability and product integrity.

IoT devices — in most instances — are based on factors requiring a combination of conventional surface mount printed circuit boards (PCB) and microelectronics manufacturing, which creates hybrid manufacturing. IoT device PCB microelectronics manufacturing most often requires dies to be placed on a PCB, which can range from rigid, flex or a combination of rigid-flex circuits. In some cases, dies can also be placed on a substrate.

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