Today, hybrid PCB manufacturing is making greater inroads into our industry, which is the marriage of traditional SMT manufacturing together with microelectronics and wire bonding. In many cases, the OEM working with EMS providers doesn’t fully understand the nuances of effective wire bonding and related failures.
What has to be considered with new hybrid manufacturing is that wire bonding involves a number of key technical steps. Those steps must be performed efficiently so that wire bonding is highly reliable. However, without experienced microelectronics/wire-bonding technicians, the assemblies may incur problems and subsequent product flaws or latent field failures.
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