Ensure IoT device reliability via die shear strength testing
My last post dealt with IoT printed circuit board wire bond reliability and making sure wire bond connections are properly performed between a bare chip and the PCB or substrate. Beyond that particular subject, there is also so much more technology associated with IoT devices and reliability. Die shear strength is one area demanding increasing attention as IoT technology trends toward greater advances.
In tech talk, the term shear refers to forces or stresses. In the case with chips or dies, shear force runs parallel to the chip or die surface.
So what’s it got to do with IoT PCBs and dies?
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