Like all printed circuit boards (PCBs), an IoT rigid-flex or flex circuit undergoes the reflowing process to make necessary circuit connections on those small boards. A correct and accurate thermal profile is the linchpin in this key reflow process.
It’s easy to go into all the technical details associated with a thermal profile. But for the purpose of this discussion, let’s simply define it this way: An experienced process engineer on the assembly floor calculates a distinctively tailored temperature formula and enters it into the reflow oven system. That’s basically the thermal profile.