Effectively transmitting electronic signals in an IoT product relies heavily on how device packaging, traces, routing and vias are designed in IoT rigid-flex or flex circuitry. Component or device packaging includes micro ball grid arrays (micro BGAs), quad-flat no-leads (QFN) and dual-flat no-leads (DFN). These electronic device packages are less than the size of a pencil eraser in some cases.
The IoT circuit designer creates signal traces and routing patterns on the rigid-flex or flex circuit. At the same time, he designs in via locations on the circuit. Vias provide the electronic connections between the different layers of a circuit board.
Today, the smaller electronic device packaging is characterized by extremely tight pitch of 0.25 – 0.20 millimeter (mm) and below. Pitch refers to the spacing between one lead or ball and the next one. There are literally hundreds of leads or tiny balls used to connect a packaged device to the flex circuit of an IoT product to conduct electronic signals.
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