Printed Circuit Design & Fab: Characteristics of a Third-Level PCB Assembly - Nexlogic
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By and large, PCB assembly up to now has been rather traditional. Surface mount technology has made significant inroads to account for the greater majority of assembly technology compared to through-hole.

However, these days PCB assembly takes on new levels of technology, complexity and service requirements differently. At level one, OEMs require standard assemblies based on standard, defined processes and expect 100% yields, or close to them…

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