Creating a thermal profile isn’t as straightforward as it once was. PCBs are populated with a growing assortment of new packaging and technologies, introducing new challenges and their associated tradeoffs when it comes to creating the thermal profile. Usually, a conventional board consists of a mix of passive and active components in traditional packaging. Increasingly, boards are populated with µBGAs, µCSPs and µQFNs, as well as the larger BGAs, CSPs, and QFNs. Plus, there is continually smaller packaging like 01005s for passive devices.
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