Package-on-package (PoP) technology is coming on strong and continues to overshadow the ever popular system-on-chip (SoC) and other similar packaging types. The rationale behind PoP is simple. More OEMs are miniaturizing their products, but are intent on adding more functionality. Hence, the only way to go to meet these challenges is to make the printed circuit board (PCB) smaller and stack packages on top of each other.
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