Nexlogic Has Been Acquired by Naprotek
To learn more about Naprotek and their capabilities, visit naprotek.com
Continue ReadingTo learn more about Naprotek and their capabilities, visit naprotek.com
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EEWeb spoke with NexLogic about how to meet the demanding PCB design & assembly requirements of medical electronics OEMs.
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We offer all kind of assemblies using complex MCM designs using dies and substrates
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NexLogic designs Interposers using either Organic Substrates, or using In-Organic Substrates such as Gallium Arsenide (Ga As), Gallium Nitride (GaN), Silicon Carbide (SiC) or similar.
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Medical device engineers at the front of the product development process will likely soon — if not already — be encountering revolutionary new and different product design...
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Wafer package designing includes – Interposer design for QFN, BGA and other packages. Wafer Manufacturing on different material, sizes, thickness and densities. Also includes Dicing, Polishing and Bumping
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The COVID-19 Pandemic came very fast to the U. S. and to the world. However, at NexLogic Technologies, we’ve maintained and advanced our PCB hardware design, assembly, and manufacturing expertise to meet such a crisis as this. Our experienced engineering staff stands ready to partner with medical equipment and ventilator OEMs to produce the much-needed circuit boards for those medical products in high demand today. Email or call us so we can jointly map out the plans to support your PCB requirements.
