Zulki Khan presenting at PCB West
When: Monday, March 27, 2006, 9 AM - 11 AM
Where: Santa Clara Convention Center, Santa Clara, CA
What: PCB West Conference Course 011 – Mixed-Signal Board Design
Speakers: Imran Khan, Syed Rizvi and Wasif Ali of Nexlogic
Attendees: PCB designers and anyone with a basic knowledge of PCB design.
Designing mixed-signal boards calls for certain considerations that are critical for achieving optimum performance. Analog and digital devices have different characteristics, including power ratings, current, voltage callouts, and heat dissipation requirements. Attendees will learn the steps to effectively design mixed-signal components on a PCB, as well as the various adverse results of not properly designing these two different technologies on a PCB.
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When: Monday, March 27, 2006 3 PM – 4 PM
Where: Santa Clara Convention Center, Santa Clara, CA
What: PCB West Conference Course 024 - The Impact of Lead-Free on Fabrication
Speaker: Zulki Khan, Nexlogic
Attendees: PCB fabricators, PCB designers and anyone interested in manufacturing PCBs in the era of RoHS and WEEE.
Get the lead out! The movement to lead-free assembly is having a distinct impact on PCB fabrication. Removing lead from the picture often causes an increase in contact time, bump speed, and peak temperature. In this one-hour workshop, attendees will learn how board thickness and surface finish affect lead-free fabrication. Attendees will learn about lead-free-compliant surface finishes (ENIG, immersion silver, OSP, etc.), why they are important to lead-free PCB fabrication, and discuss the various tradeoffs and key advantages associated with each finish.
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When: Thursday, March 30, 2006, 11 AM – 12 PM
Where: Santa Clara Convention Center, Santa Clara, CA
What: PCB West Conference Course 074 - DFM, Test and Assembly Strategies
Speaker: Zulki Khan, Nexlogic
Attendees: PCB designers, test engineers, layout engineers and assembly personnel.
Product and technology evolution continues to play a significant and ever changing role in PCB design for manufacture (DFM), test, and assembly. DFM, test and assembly strategies must focus on the OEM’s specific product needs and the required techniques and methodologies used. Attendees will learn details of each aspect of DFM, test, and assembly, as well as methods for deploying correct strategies at specific levels of products: consumer, industrial, medical and mil/aerospace. Examples of ineffective DFM, test, and assembly techniques will also be discussed.
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