Tag Archives: Tip of the month

Home » Posts tagged "Tip of the month"

Get On the Right Wavelength for RF

RF circuits are designed to pass signals within a certain band. They use band pass filters to transmit signals in a so-called band of interest. The signal within a range of frequency passes through this band range, and the rest of the frequencies of the signal are filtered. A single band can be very narrow […]

Continue Reading...

Stay Ahead of Smaller PCBs To Maintain Reliability

OEMs continue to demand greater functionality in smaller portable and handheld products, such as wearables and IoT devices. As a result, a number of attributes are demanded these days for PCBs in smaller mobile technologies. Along with those attributes come a host of challenges in terms of layout, fabrication, and assembly, plus assuring many of […]

Continue Reading...

Light Up Your LED PCB Projects

LEDs are the light of choice for growing numbers of applications due to their shrinking size, as well as declining cost and longer life. But LEDs pose a host of issues to the PCB layout designer including thermal management challenges. Within thermal management, there are a few other key issues to ponder. Those involve PCB […]

Continue Reading...

Component Placement More Critical Than Ever

We’re now talking about BGA-packaged components with 4,000 or so leads or balls, 0.3mm pin pitch and below, highly component populated automatic test equipment PCBs, and ever shrinking conventional PCBs and small flex circuits for Internet of Things (IoT) and wearables. That tells you that component placement on these PCBs at the pick and place […]

Continue Reading...

Check Out Thermal Management Considerations

There are a number of considerations an experienced PCB designer applies for thermal management. However, the key design steps essential for effectively dissipating heat are: Properly distributing analog circuitry throughout the board. Effectively using ground pour on the PCB. Strategically deploying thieving, when possible. Considering a metal core (MC) board, if applicable. Creating more solid […]

Continue Reading...

Micro BGA Gains Popularity for Wearable/IoT PCBs

With the increasing demands for wearable and Internet of Things (IoT) devices, chipmakers are scrambling to yet pack even more circuitry into even smaller component packaging. The micro ball-grid array (BGA) package is a case in point. Fig. 1 shows micro BGA-packaged devices placed on a flex circuit for a medical electronics application. These tiny […]

Continue Reading...

Advanced Packaging Reshaping PCB Landscape

Can you imagine component packaging so small you can barely see it. And if you accidentally sneeze while trying to see it, it’s literally blown away forever. You’ll never find it. Active and passive device packaging of those dimensions is what you’ll be dealing with as PCB technology continues to move forward into increasingly smaller […]

Continue Reading...

FAI – Top Priority for Top Quality PCB Manufacturing

As shown in Fig. 1, first article inspection or FAI takes a back seat at best in a number of today’s PCB assembly and manufacturing operations. At times, it falls victim to large engineering egos with a strong belief that a particular PCB is “a simple, easy board” that doesn’t require extra time and expense […]

Continue Reading...

Accurate Component Placement – More Critical Than Ever

Component placement is taking center stage more so today than ever before. Why? The reason is increasing numbers of different package types and sizes are now used due to shrinking PCBs. The pick and place operation during PCB assembly is demanding greater attention as a result. This means placement demands a well-disciplined list of checks, […]

Continue Reading...