President Obama’s “Blueprint for an America Built to Last” is indeed an ambitious initiative and should be highly supported to encourage “insourcing,” create more manufacturing jobs in America, and help to significantly strengthen our economy. There is no question that the U.S. has the know-how and technologies to manufacture virtually any product, as the president […]Continue Reading...
The industry is turning the page on co-planarity and what it’s finding is a host of new issues. Some are brought on by the fact that BGA technology is now at the 0.3 and 0.25mm ultra-fine pitch stage and requires a renewed and critical look at surface finishes. Other co-planarity issues deal with BGA placement, […]Continue Reading...
The first two quarters of 2011 were highly active, but business became sluggish even as advanced technologies moved into high gear. But then, in the third quarter, all that excitement, all that sizzle, faded away virtually overnight. Read MoreContinue Reading...
Unless foreign object debris-free PCB assembly is rigorously practiced, the military/aerospace, high-reliability OEM is inviting fear, uncertainty and doubt (FUD). The mil/aero OEM or contractor must cast a wary eye on the assembly floor to catch the most innocent-looking to the most blatant FOD violations. Read MoreContinue Reading...
Successful ultra-fine feature solder printing has become difficult, more challenging with the continuing trend toward miniaturizing electronic assemblies, thus posing printing issues for difficult applications. At the same time, OEMs are demanding not only increasing reliability of their high-density PCB applications, but also high, near 100 percent yields, a crucial requirement in today’s highly competitive […]Continue Reading...
Shrinking component size is dramatically changing the landscape of reflow processes. The most challenging issue for contract manufacturers and EMS providers are leadless BGAs. These small devices are now making their presence known as a new technology one not well-defined in terms of reflow process. Read MoreContinue Reading...
In the case of mixed-signal, analog, and mostly analog boards, special attention must go to careful thermal analysis. The PCB designer performing the thermal analysis must best to deploy certain design steps and techniques to maximize heat dissipation through component and board levels. In the case of mixed-signal, analog, and mostly analog boards, special attention […]Continue Reading...
Soldering defects can occur from reflow, wave, or hand soldering. However, the most prone to defects is reflow soldering for SMT. Reflow soldering is more complex compared to other forms of soldering. Reflow soldering requires the development and use of a correct thermal profile. Most often, the usual industry practice is to develop a thermal […]Continue Reading...
There are two ways to perform quality assurance (QA). One is to move a PCB through design, fabrication, and assembly focusing on expediting the project, but leaving QA at the end of the process. Time is definitely saved by placing QA as an afterthought, but too much of the process is left questionable. The second, […]Continue Reading...
The old saying, “It’s never too late,” applies to some Johnny-come-lately medical electronics OEMs that aren’t ready to comply with the EU’s upcoming new RoHS directives. The initial 2006 directive didn’t include medical electronics, but now RoHS will. This means medical electronics OEMs must discard eutectic SMT-based designs and think of SMT lead-free products. In […]Continue Reading...