Tag Archives: SMT Magazine

Home » Posts tagged "SMT Magazine"

SMT: Zulki’s PCB Nuggets – Tighter Scrutiny Needed for PCB Cleaning Agents

PCB cleanliness on the assembly floor is now getting more attention, due to tiny residues and contaminants being left on assemblies after new, advanced assembly processes. Cleaning methodologies, testing, analysis, and special chemistries are being taken to a new level to assure customers of ultraclean boards to avoid costly latent issues… Read More

Continue Reading...

SMT: Zulki’s PCB Nuggets – Uncovering Assembly Problems of High-Speed PCBs

High-speed PCBs have become much more common during the past five years. However, special challenges arise due to unanticipated high-speed issues. Some relate to manufacturing or processes, while others are pure component- or fabrication-based. In particular, highly complex, highly integrated components like FPGAs need close scrutiny. Also, it’s important to note that PCBs may use […]

Continue Reading...

SMT: Zulki’s PCB Nuggets – EMS Discovers Mature IC Technologies

Did you know that really new, up-to-the-moment PCB technologies are nesting on the doorstep of PCB assemblers? In fact, some of these technologies are very mature, but they’re new to PCB assemblers. For the past year or so, we’ve been talking about package-on-package (PoP) and 0.4 to 0.3-mm pitch BGAs as new technologies, and certainly […]

Continue Reading...

SMT: Zulki’s PCB Nuggets – Another Look at AOI

PCB inspection is taking on greater significance as boards and packaging become increasingly smaller, with greater functionality. Automated optical inspection (AOI) and its backup associate, X-ray, team up to catch a variety of board assembly problems. But it’s AOI that’s at the forefront of this process. Read More

Continue Reading...

SMT: Zulki’s PCB Nuggets – ECOs Reviewed – The Importance of Accuracy

Engineering change orders (ECOs) have been part of the product development and PCB landscapes for as far back as one can remember. Particularly, when it comes to ECOs for PCBs, there are varying and endless reasons for these changes. Certainly, PCB designers can perfectly layout a design and, in theory, follow written specifications to the […]

Continue Reading...

SMT: Zulki’s PCB Nuggets – FAI – An Ounce of Prevention, Worth a Pound of Cure

Shrinking PCB real estate, ultrafine-pitch devices, package-on-package technologies, thinner boards, and the recent adoption of challenging device packaging give the use of first article inspection greater importance. Read More

Continue Reading...

Zulki’s PCB Nuggets: The Intricacies of RF Design & Assembly

Decades ago, successfully and economically completing an RF design was a monumental, almost impossible task due to the fact that much of the necessary technology and know-how were not available. Consequently, great demand for such design just didn’t exist, although most focused on costly applications going to high-end industrial and mil/aero applications. Today, the demand […]

Continue Reading...

Zulki’s PCB Nuggets: Critical Aspects of a Thermal Profile

In this day and age, the technologies and know-how going into PCB assembly are dramatically escalating and, for some assemblers, it’s difficult to keep up with those advancements. Take, for example, the thermal profile, one of the most important yet constantly changing elements in the PCB assembly process. Unfortunately, there’s still a belief in our […]

Continue Reading...

Zulki’s PCB Nuggets: Get a New View on X-Ray

It used to be that original equipment manufacturers (OEMs) didn’t know much about X-ray at the PCB assembly stage–they didn’t care too much about it or it just wasn’t on their priority list as a key step for achieving PCB assembly reliability. After all, X-ray is in the domain of the contract manufacturer (CM) or […]

Continue Reading...

MEMS/SMT Hybrid PCBs Take Design/Assembly Detour

The main thrust of microelectronics, since their inception, has been continual miniaturization to make chips, PCBs, and systems smaller, faster, increasingly functional, and more reliable. Subsequently, microelectromechanical systems (MEMS) came into the electronics industry limelight with significant benefits. Today, hybrid MEMS/surface mount technology (SMT) subsystems on PCBs are making greater inroads into OEM markets.When you […]

Continue Reading...